Auto dual-arm laser wafer marking system
| Auto dual-arm laser wafer marking system |
| The system supports 2D code and OCR reading before and after wafer marking. Precision and efficiency laser wafer marking system from FitTech provides multiple marking forms, including texts, numbers, barcodes, 2D code, QR code, etc., for product identification and traceability through the manufacturing process. |
- Markets
Semiconductor manufacturing
- Applications
Wafer marking
- Materials
Silicon(Si), Silicon Carbide(SiC), GaAs, Sapphire, Compound wafer, etc.
■ Support 4” to 6” wafer marking
■ High quality, throughput, and reliability production
■ Highly-readable marks
■ Cleanliness level
■ Support 2D code and OCR reading
Why FitTech?
FitTech focus on design and manufacturing photoelectric related system. We provide accurate and exquisite processing quality with leading R&D capability.
With well experienced and our completed and elite R&D team, customized such as automated, integrated with robot, system integration, etc. are all available.
FitTech's Laser cutting/drilling Machine that design and manufactured in Taiwan. And we also provide instance after service by our elite technical team.
Know more about Laser metal machining Series
General Specifications
| Item | Specification |
|---|---|
| Class of Dust Free | CLASS 10000 |
| Application | 4” 5” 6” wafer(100mm,125mm,150mm) |
| Cassette | Max: 25 Slots |
| Repeatability | ±0.2 mm |