FCM 6104

Auto laser wafer marking system

Auto laser wafer marking system
Precision and efficiency laser wafer marking system from FitTech provides multiple marking forms, including texts, numbers, barcodes, 2D code, QR code, etc., for product identification and traceability through the manufacturing process.

       
  • Markets

    Semi-conductor/ Semiconductor manufacturing

  • Applications

    Wafer marking

  • Materials

    Semiconductor Si wafer
    Compound semiconductor: SiC、III V: GaAs、GaN, III VI、Lt、Ln
    Sapphire、metal、ceramic

 


 

■ Support 2” to 4” or 4” to 6” wafer

■ Optical fiber laser or DPSS

■ High quality, Efficiency and productivity

■ Character, Semi font, barcode, 2D code

■ SECS GEM standard is available (optional)

■ Small footprint (850x1280mm)

■ User friendly

 

Why FitTech?

 


FitTech focus on design and manufacturing photoelectric related system. We provide accurate and exquisite processing quality with leading R&D capability.


With well experienced and our completed and elite R&D team, customized such as automated, integrated with robot, system integration, etc. are all available.


FitTech's Laser cutting/drilling Machine that design and manufactured in Taiwan. And we also provide instance after service by our elite technical team.

 

 

Know more about Laser Micromachining Series

Product inquiry/Contact us

 


General Specifications 

Item Specification
MaterialSi, SiC, sapphire, III-V, LT, LN
Wafer size2”-4” or 4“-6” (Flat/Notch)
Wafer thickness250um≤ T<700um
Throughput15 min/ cassette (25 pcs)
PatternBar code, 2D code
Repeatability±0.2mm
LaserIR, Green, or UV