Auto laser wafer marking system

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• Markets

  Semiconductor manufacturing

• Applications

  Wafer marking

• Materials

  Si wafer
  GaAs、GaN、II-VI: Lt(LiTaO₃)、Ln(LiNbO₃) wafer、Sapphire

   

■ Support 2”- 4” 、 4”- 6” 、6”-8”wafer marking

■ Choose the laser wavelength (IR or UV) based on the product characteristics for optimal pairing.

■ High quality, efficiency and output

■ Supports backside marking

■ Supports various formats, including Semi OCR, alphanumeric strings, barcodes, 2D codes, and graphics.

■ Supports SECS GEM standard

■ Equipped with a dust collection system and isolation area to reduce dust splashing and ensure easy maintenance.

■ Intuitive software interface with built-in marking preview and cassette anomaly detection.

■ Precise laser parameter settings combined with in-house optical technology to reduce the heat effects from the laser.

＊The functions of the equipment in the series vary by model

Model specifications

Actual marking results

Provides multiple marking forms, including Semi OCR, Semi Double, texts, numbers, barcode and 2D codes (Data Matrix/QR code), Graphics and curve arrangement

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Why FitTech?

FitTech focus on design and manufacturing photoelectric related system. We provide accurate and exquisite processing quality with leading R&D capability.

With well experienced and our completed and elite R&D team, customized such as automated, integrated with robot, system integration, etc. are all available.

FitTech's Laser cutting/drilling Machine that design and manufactured in Taiwan. And we also provide instance after service by our elite technical team.