Semi-conductor/ Opto-electrical /PCB industry
Through via drilling (THV) / Routing / Patterning / Marking: Character, 2D matrix
PCB / Ceramic substrate, metal sheet
– Industry-leading capabilities for laser via drilling
– Low cost of ownership
– high-accuracy and high-speed processing solution
– Self-developed R&D team, provides friendly user interface
– Multi-functional micromachining in one stage
– Support DXF format
FitTech focus on design and manufacturing photoelectric related system. We provide accurate and exquisite processing quality with leading R&D capability.
With well experienced and our completed and elite R&D team, customized such as automated, integrated with robot, system integration, etc. are all available.
FitTech's Laser cutting/drilling Machine that design and manufactured in Taiwan. And we also provide instance after service by our elite technical team.