LED Flip Chip/wafer probing and testing system
| LED Flip chip / wafer probing and testing system |
A high-efficiency testing and probing solution designed specifically for Flip Chip LED. It enables precise testing of LED/Mini LED chips or wafers. Equipped with multi-channel testing capability and optional support for top or bottom light measurement, it significantly enhances production efficiency and testing accuracy.
■ Markets
Optoelectronic Industry / Optical Communication Industry
■ Applications
Wafer/Chip testing
■ Materials
Flip Chip LED /Mini LED
■ Applicable to Flip Chip LED / Mini LED
■ Integrates prober and tester, supporting both wafer and chip testing
■ Uses imported lead screws to enhance mechanical rigidity and minimize the backlash
■ Loadcell ensures identical needle marks and extend the lift time
■ Supports simultaneous top-side and bottom-side light collection
■ Supports testing with up to 8 channels
■ Supports LOP testing at 0.1mA (with 1% repeatability)
Test specification
Supports low current measurement for MiniLED
Wafer Size: Up to 6 inch
Min. chip size : 03x05 mil
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