6"-8" Bare wafer, Backside-coated wafer, molding compound substrate or L/F
Applications of 6”-8" WLCSP Laser marking system
Customized integration of optical system.
Font size 600um
Font size 110um
■ Support 6"-8” Bare wafer, Backside-coated wafer, molding compound substrate or L/F
■ Dual high scanning accuracy and alignment System.
■ Automatic wafer position correction & vacuum holes optimization.
■ Post-mark inspection & Depth inspection.
■ Self-owned R&D team, designed optical module and laser S/W integration.
■ Smart system, implement the SECS/GEM standard.
Laser marking of computer inspection
Support Post-mark inspection & Depth inspection.
FitTech focus on design and manufacturing photoelectric related system. We provide accurate and exquisite processing quality with leading R&D capability.
With well experienced and our completed and elite R&D team, customized such as automated, integrated with robot, system integration, etc. are all available.
FitTech's Laser cutting/drilling Machine that design and manufactured in Taiwan. And we also provide instance after service by our elite technical team.
|Application||6” Wafer / 8” Wafer|
|Marking Shift||±15um @Field=15x15mm|
|PC Control||Windows Base. 1 PC or dual PC are available|
|Dimension & weight||(W)1200mm * (D)1300mm * (H)1800mm, 950 Kgs|