LCM 6134

6” WLCSP Laser marking system

6” WLCSP Laser marking system

Automatic wafer position correction & vacuum holes optimization.

Precision and efficiency laser wafer marking system, provides multiple marking forms for product identification and traceability through the manufacturing process.


     
  • Markets

    Semiconductor manufacturing

  • Applications

    Wafer marking

  • Materials

    6"-8" Bare wafer, Backside-coated wafer, molding compound substrate or L/F

 


 

 

Applications of 6”-8" WLCSP Laser marking system

Customized integration of optical system.

 

 



Compound

Font size 600um



Substrate

Code 2000*2000um



Ceramic

Font size 110um

 

 

■ Support 6"-8” Bare wafer, Backside-coated wafer, molding compound substrate or L/F

■ Dual high scanning accuracy and alignment System.

■ Automatic wafer position correction & vacuum holes optimization.

■ Post-mark inspection & Depth inspection.

■ Self-owned R&D team, designed optical module and laser S/W integration.

■ Smart system, implement the SECS/GEM standard.

 

Laser marking of computer inspection

Support Post-mark inspection & Depth inspection.

 

 

Know about Tray-in Marking system

Know about Strip Marking system

 

 

 

Why FitTech?

 


FitTech focus on design and manufacturing photoelectric related system. We provide accurate and exquisite processing quality with leading R&D capability.


With well experienced and our completed and elite R&D team, customized such as automated, integrated with robot, system integration, etc. are all available.


FitTech's Laser cutting/drilling Machine that design and manufactured in Taiwan. And we also provide instance after service by our elite technical team.

 

 

Know more about Semi-conductor application

Product inquiry/Contact us

 


General Specifications 

Item Specification
Application6” Wafer / 8” Wafer
Marking Shift±15um @Field=15x15mm
PC ControlWindows Base. 1 PC or dual PC are available
Dimension & weight(W)1200mm * (D)1300mm * (H)1800mm, 950 Kgs