6” WLCSP Laser marking system
| 6” WLCSP Laser marking system |
Automatic wafer position correction & vacuum holes optimization. Precision and efficiency laser wafer marking system, provides multiple marking forms for product identification and traceability through the manufacturing process. |
- Markets
Semiconductor manufacturing
- Applications
Wafer marking
- Materials
6"-8" Bare wafer, Backside-coated wafer, molding compound substrate or L/F
Applications of 6”-8" WLCSP Laser marking system
Customized integration of optical system.
Compound
Font size 600um
Substrate
Code 2000*2000um
Ceramic
Font size 110um
■ Support 6"-8” Bare wafer, Backside-coated wafer, molding compound substrate or L/F
■ Dual high scanning accuracy and alignment System.
■ Automatic wafer position correction & vacuum holes optimization.
■ Post-mark inspection & Depth inspection.
■ Self-owned R&D team, designed optical module and laser S/W integration.
■ Smart system, implement the SECS/GEM standard.
Laser marking of computer inspection
Support Post-mark inspection & Depth inspection.
Know about Tray-in Marking system
Know about Strip Marking system
Why FitTech?
FitTech focus on design and manufacturing photoelectric related system. We provide accurate and exquisite processing quality with leading R&D capability.
With well experienced and our completed and elite R&D team, customized such as automated, integrated with robot, system integration, etc. are all available.
FitTech's Laser cutting/drilling Machine that design and manufactured in Taiwan. And we also provide instance after service by our elite technical team.
Know more about Semi-conductor application
General Specifications
| Item | Specification |
|---|---|
| Application | 6” Wafer / 8” Wafer |
| Marking Shift | ±15um @Field=15x15mm |
| PC Control | Windows Base. 1 PC or dual PC are available |
| Dimension & weight | (W)1200mm * (D)1300mm * (H)1800mm, 950 Kgs |
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