6" Bare Wafer, wafer back side coating (WBC), Molded Wafer
Applications of 6” WLP Laser marking system
Customized integration of optical system.
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■ Support 6-8” Bare Wafer,wafer back side coating (WBC), Molded Wafer
■ Dual high scanning accuracy and alignment System.
■ Automatic wafer position correction & vacuum holes optimization.
■ Post-mark inspection & Depth inspection.
■ Self-owned R&D team, designed optical module and laser S/W integration.
■ Smart system, implement the SECS/GEM standard.
Laser marking of computer inspection
Support Post-mark inspection & Depth inspection.
FitTech focus on design and manufacturing photoelectric related system. We provide accurate and exquisite processing quality with leading R&D capability.
With well experienced and our completed and elite R&D team, customized such as automated, integrated with robot, system integration, etc. are all available.
FitTech's Laser cutting/drilling Machine that design and manufactured in Taiwan. And we also provide instance after service by our elite technical team.