6” WLP Laser marking system
| 6” WLP Laser marking system |
Automatic wafer position correction & vacuum holes optimization. Precision and efficiency laser wafer marking system, provides multiple marking forms for product identification and traceability through the manufacturing process. |
- Markets:
Semiconductor manufacturing
- Applications:
Wafer marking
- Materials:
6" Bare Wafer, wafer back side coating (WBC), Molded Wafer
Applications of 6” WLP Laser marking system
Customized integration of optical system.
Compound
Font size 600um
Substrate
Code 2000*2000um
Ceramic
Font size 110um
■ Support 6-8” Bare Wafer,wafer back side coating (WBC), Molded Wafer
■ Dual high scanning accuracy and alignment System.
■ Automatic wafer position correction & vacuum holes optimization.
■ Post-mark inspection & Depth inspection.
■ Self-owned R&D team, designed optical module and laser S/W integration.
■ Smart system, implement the SECS/GEM standard.
Laser marking of computer inspection
Support Post-mark inspection & Depth inspection.
Know about Tray-in Marking system
Know about Strip Marking system
Why FitTech?
FitTech focus on design and manufacturing photoelectric related system. We provide accurate and exquisite processing quality with leading R&D capability.
With well experienced and our completed and elite R&D team, customized such as automated, integrated with robot, system integration, etc. are all available.
FitTech's Laser cutting/drilling Machine that design and manufactured in Taiwan. And we also provide instance after service by our elite technical team.
Know more about Semi-conductor application