EMC Wafer Laser Micromachining System
| EMC Wafer Laser Micromachining System |
| FCM 8401 features a mulifunctional EMC wafer laser micromachining system designed for 3D IC and FOLOP applications. It supports 300mm EMC wafer trimming/grooving, notch cutting, and ID marking. With precise wafer alignment and control, it completely removes EMC residue without damaging the carier glass, improving de-bonding yield and reducing the risk of wafer cracks. |
- Markets
Wafer-Level Packaging Process，3D IC 、FOLOP
- Applications
EMC Trimming / Grooving、Notch Cutting、ID Marking
- Materials
Epoxy Molding Compound（EMC）
■ Multifunctional laser micromaching system
■ Applied on Ø300 EMC wafers 3D IC/FOLOP packaging
■ Non-contact cleaning, precise EMC wafers removal, no residue, no glass damage
■ In-house optical design for better thermal control and better quality
■ Throughput：≧ 15 WPH
■ Particle & ESD control
Processing Technology
Trimming / Grooving
Pico IR laser precisely removes EMC with no residue or carrier glass damage, ensuring de-bonding yield and reducing wafer crack risks.
Notch Cutting
recisely aligning to the notch for cutting, exposing the carrier glass edge without damage, and improving post-process alignment accuracy.
ID Marking
EMC wafer serial marking with SEMI standard fonts for production traceability.
Why FitTech?
FitTech focus on design and manufacturing photoelectric related system. We provide accurate and exquisite processing quality with leading R&D capability.
With well experienced and our completed and elite R&D team, customized such as automated, integrated with robot, system integration, etc. are all available.
FitTech's Laser cutting/drilling Machine that design and manufactured in Taiwan. And we also provide instance after service by our elite technical team.