Silicon Photonics Solution
| Silicon Photonics Solution |
| The development of AI, high-performance computing (HPC), and data centers has driven the demand for high-speed transmission, making silicon photonics and CPO technology key drivers. FitTech is investing in the development of silicon photonics process equipment technology, providing solutions such as FAU Automated Optical Inspection, Photonic Device Assembling, Fiber Array Unit Functional Testing, and Photonic Device Testing. |
With the wave of AI and its widespread applications, the demand for electronic transmission and computing performance in data centers and HPC is rapidly growing, making silicon photonics and CPO integrated optical packaging technology a crucial driver in the development of high-bandwidth transmission technologies.
What is Silicon Photonics?
Silicon photonics uses semiconductor processes to manufacture optical components on silicon wafers, and through CPO technology, tightly integrates photonic chips (PIC) with electronic components (EIC). Silicon photonics replaces part of the traditional copper wiring with optical waveguides, enabling photon-based transmission.
This offers several advantages, including higher data transmission rates, lower signal latency, and reduced power consumption, but it still face numerous technical challenges, such as the integration of optoelectronic signals, optical coupling signal loss, and heat dissipation issues, etc.
FitTech silicon photonics products
Silicon Photonics Applications
Silicon photonics offers advantages such as high bandwidth, low power consumption, and long-distance transmission, making it capable of meeting the performance, power, cost, and scalability requirements of network interconnects. As a result, it can be widely applied in fields such as AI, data centers, HPC, LiDAR, communications, and sensors.
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