Auto laser wafer marking system
|Auto laser wafer marking system|
|Precision and efficiency laser wafer marking system from FitTech provides multiple marking forms, including texts, numbers, barcodes, 2D code, QR code, etc., for product identification and traceability through the manufacturing process.|
Semi-conductor/ Semiconductor manufacturing
Semiconductor Si wafer
Compound semiconductor: SiC、III V: GaAs、GaN, III VI、Lt、Ln
■ Support 2” to 4” or 4” to 6” wafer
■ Optical fiber laser or DPSS
■ High quality, Efficiency and productivity
■ Character, Semi font, barcode, 2D code
■ SECS GEM standard is available (optional)
■ Small footprint (850x1280mm)
■ User friendly
FitTech focus on design and manufacturing photoelectric related system. We provide accurate and exquisite processing quality with leading R&D capability.
With well experienced and our completed and elite R&D team, customized such as automated, integrated with robot, system integration, etc. are all available.
FitTech's Laser cutting/drilling Machine that design and manufactured in Taiwan. And we also provide instance after service by our elite technical team.
|Material||Si, SiC, sapphire, III-V, LT, LN|
|Wafer size||2”-4” or 4“-6” (Flat/Notch)|
|Wafer thickness||250um≤ T<700um|
|Throughput||15 min/ cassette (25 pcs)|
|Pattern||Bar code, 2D code|
|Laser||IR, Green, or UV|