Auto laser wafer marking system
Auto laser wafer marking system |
Precision and efficiency laser wafer marking system from FitTech provides multiple marking forms, including texts, numbers, barcodes, 2D code, QR code, etc., for product identification and traceability through the manufacturing process. |
- Markets
Semi-conductor/ Semiconductor manufacturing
- Applications
Wafer marking
- Materials
Semiconductor Si wafer
Compound semiconductor: SiC、III V: GaAs、GaN, III VI、Lt、Ln
Sapphire、metal、ceramic
■ Support 2” to 4” or 4” to 6” wafer
■ Optical fiber laser or DPSS
■ High quality, Efficiency and productivity
■ Character, Semi font, barcode, 2D code
■ SECS GEM standard is available (optional)
■ Small footprint (850x1280mm)
■ User friendly
Why FitTech?
FitTech focus on design and manufacturing photoelectric related system. We provide accurate and exquisite processing quality with leading R&D capability.
With well experienced and our completed and elite R&D team, customized such as automated, integrated with robot, system integration, etc. are all available.
FitTech's Laser cutting/drilling Machine that design and manufactured in Taiwan. And we also provide instance after service by our elite technical team.
Know more about Laser Micromachining Series
General Specifications
Item | Specification |
---|---|
Material | Si, SiC, sapphire, III-V, LT, LN |
Wafer size | 2”-4” or 4“-6” (Flat/Notch) |
Wafer thickness | 250um≤ T<700um |
Throughput | 15 min/ cassette (25 pcs) |
Pattern | Bar code, 2D code |
Repeatability | ±0.2mm |
Laser | IR, Green, or UV |